[{"data":1,"prerenderedAt":-1},["ShallowReactive",2],{"brand-riyuexin":3},{"head":4,"company":39,"invest":44,"children":45,"shops":46,"category":47,"sameIndustry":5,"rid":6},{"createTime":5,"updateTime":5,"createBy":5,"updateBy":5,"brandId":6,"brandLogo":7,"brandImage":5,"brandName":8,"webName":9,"balias":5,"enterId":10,"mainindustry":11,"industry":5,"brandType":5,"brandHonor":5,"brandTel":5,"establishdate":12,"brandBirth":13,"cityarea":5,"brandWebsite":5,"brandSobp":5,"brandVisit":5,"totalVisits":14,"status":15,"isDeleted":15,"comment":5,"remark":5,"logoExistStatus":16,"imageExistStatus":16,"industryId":5,"industryRanking":5,"score":5,"enterName":17,"mallShopList":18,"brandSummary":19,"likes":5,"unlikes":5,"follow":5,"pagetitle":20,"pagekeywords":21,"pagedesc":22,"brandContent":23,"province":5,"city":5,"area":5,"detailaddress":24,"unifiedscc":25,"enterType":26,"enterLegalperson":27,"enterStablishdate":28,"regauthority":29,"licenseValidity":30,"approvaldate":31,"regcapital":32,"incapital":33,"businessscope":34,"ownBrand":5,"enterTelphone":35,"enterWebsite":36,"business":37,"enterQq":5,"enterMail":38,"bindUser":5,"enterMployeenum":5,"regcapitalunit":5,"abnormal":5,"yeartax":5,"regtrademark":5},null,"4158393","\u002Fprofile\u002Fupload\u002F2023\u002F12\u002F02\u002F6fed2c4247cd43c9eb5e38497c2c805e.gif","日月新","riyuexin",723747,10380,"2001年","苏州市",325,0,"1","日月新半导体（苏州）有限公司",[],"2021年智路资本收购日月光集团位于中国大陆苏州\u002F昆山\u002F上海和威海的工厂更名而来,主要面向5G\u002FIoT应用的射频器件及面向工业与汽车应用的功率器件封测领域。","日月新简介-日月新芯片封装-中国品牌之家","日月新品牌介绍,日月新半导体(苏州)有限公司,日月新联系电话,日月新芯片封装,日月新","日月新品牌简介，中国品牌之家为你介绍日月新半导体(苏州)有限公司旗下日月新品牌信息，包括品牌介绍、联系方式、主营产品、最新评论、点赞数量等，告诉你日月新芯片封装怎么样，致力于帮助你了解日月新真实有效的品牌相关信息。","日月新集团主要从事半导体元器件的封装测试业务。作为全球半导体封测知名企业，日月新集团为全球客户提供封装设计、前段工程测试、晶圆针测、后段半导体封装、成品测试的一体化服务，并且拥有集技术研发为一体的检测中心，以先进设备和丰富的半导体封装测试经验，为客户提供完善的电子制造服务的整体解决方案。日月新集团坚持以人为本，透过严谨的工程、纪律的生产，使命达成第一的品质，以赢得客户的满意、成就永续的经营。\n\n日月新苏州厂成立于2001年，2007年日月光集团与NXP合资设立苏州日月新，2018年日月光集团取得苏州日月新100%股权，拓展并服务全球半导体封装及测试市场。2021年12月，智路资本与日月光集团完成股权转让，更名为日月新半导体（苏州）有限公司，且做为日月新集团总部。\n\n公司不断创新的思维，投注于半导体先进制程技术的研发，高素质的研发团队持续发展先进的技术与制程，满足客户对于强化产品功能与降低成本的需求，也获得多项技术专利。公司自成立以来，营收、获利、人员都保持迅速增长，现有员工已超4000名，是一家重视品质、研发、技术、人才培育、员工沟通、员工健康的公司。","苏州工业园区苏虹西路188号","91320594728014317G","有限责任公司(港澳台法人独资)","原志刚","2001-05-14","苏州工业园区市场监督管理局","2001-05-14 至 2051-05-13","2024-12-04","4,867.236万(美元)","4,867.2360万(美元)","研发、制造、装配、测试集成电路和半导体器件；同时提供与集成电路和半导体器件相关的服务和技术咨询。（依法须经批准的项目，经相关部门批准后方可开展经营活动）","0512-67251788","www.atxsemicon.com","计算机、通信和其他电子设备制造业","YW_Wang@atxsemicon.com",{"enterId":40,"enterName":17,"province":5,"city":5,"area":5,"detailaddress":24,"unifiedscc":25,"enterType":26,"enterLegalperson":27,"enterStablishdate":28,"regauthority":29,"licenseValidity":30,"approvaldate":31,"regcapital":32,"incapital":33,"businessscope":34,"ownBrand":5,"enterTelphone":35,"enterWebsite":36,"business":37,"performance":41,"socialSecurity":42,"registrationNumber":43,"enterQq":5,"enterMail":38,"bindUser":5,"enterMployeenum":5,"regcapitalunit":5,"abnormal":5,"yeartax":5,"status":15,"regtrademark":5,"remark":5},"723747","开业","30616人","320594400002472",{"createTime":5,"updateTime":5,"createBy":5,"updateBy":5,"id":5,"brandId":5,"brandName":5,"busmodel":5,"franchiseFund":5,"totalStores":5,"devmodel":5,"franchiseIndustry":5,"investmenttel":5,"suitablePeople":5,"state":5},[],[],[48],{"createTime":49,"updateTime":50,"createBy":5,"updateBy":5,"industryId":51,"webId":5,"industryName":52,"industryAlias":5,"industryIcon":5,"industryTrans":53,"pageTitle":54,"pageDesc":55,"pageKeywords":56,"mainTitle":57,"pageSubtitle":58,"indSummary":59,"industryLevel":60,"parentId":61,"parentName":5,"sortOrder":62,"status":15,"classifyVisit":5,"totalVisits":63,"searchName":5,"starLevel":5,"limit":5},"2000-01-01 00:00:00","2026-06-16 16:50:00","10380","芯片封装","\u002Fprofile\u002Fupload\u002F2023\u002F11\u002F08\u002F371fb87c4eb9609ca41c22b5fa486c2f.jpeg","十大芯片封装企业-芯片封装公司有哪些-芯片封装厂商有哪些-ZGALL品牌榜","2026年芯片封装行业十大品牌权威发布！芯片封装排行榜前十名品牌有日月光、安靠、长电、通富微电、华天、力成、京元电子、WLCSP、日月新、UTAC。芯片封装10大品牌排行榜由品牌研究部门收集整理大数据分析、研究得出，帮助你了解芯片封装哪个牌子好。","芯片封装公司排名,业界主流的芯片封装厂,十大芯片封装公司排名,十大芯片封装品牌,中国十大芯片封装公司","芯片封装品牌排行榜","2026芯片封装企业排行榜，半导体封测-封测代工厂，集成电路封装测试企业有哪些","芯片封装哪个好？品牌TOP榜权威发布2026年芯片封装名录；居前十的有：日月光、AMKOR安靠、长电科技JCET、通富微电、华天科技HUATIAN、力成Powertech Technology、京元电子KYEC、WLCSP、日月新ATX、UTAC等，【行业品牌名录】基于大数据与人工智能技术，整合300+国际权威榜单及企业申报数据，通过算法分析市场占有率、创新力等12项指标，并解析超百万条舆情信息，采用加权模型（算法60%+专家30%+用户10%）生成动态排名。数据月度更新，申报需通过ISO认证审核，排名不分先后，仅供参考。",3,4965,99,717]