[{"data":1,"prerenderedAt":-1},["ShallowReactive",2],{"brand-05licheng":3},{"head":4,"company":28,"invest":30,"children":31,"shops":32,"category":33,"sameIndustry":5,"rid":6},{"createTime":5,"updateTime":5,"createBy":5,"updateBy":5,"brandId":6,"brandLogo":7,"brandImage":5,"brandName":8,"webName":9,"balias":5,"enterId":10,"mainindustry":11,"industry":5,"brandType":5,"brandHonor":5,"brandTel":5,"establishdate":12,"brandBirth":13,"cityarea":5,"brandWebsite":5,"brandSobp":5,"brandVisit":5,"totalVisits":14,"status":15,"isDeleted":15,"comment":5,"remark":5,"logoExistStatus":16,"imageExistStatus":16,"industryId":5,"industryRanking":5,"score":5,"enterName":17,"mallShopList":18,"brandSummary":19,"likes":5,"unlikes":5,"follow":5,"pagetitle":20,"pagekeywords":21,"pagedesc":22,"brandContent":23,"province":5,"city":5,"area":5,"detailaddress":13,"unifiedscc":5,"enterType":5,"enterLegalperson":5,"enterStablishdate":24,"regauthority":5,"licenseValidity":25,"approvaldate":24,"regcapital":5,"incapital":5,"businessscope":5,"ownBrand":5,"enterTelphone":5,"enterWebsite":26,"business":5,"enterQq":5,"enterMail":27,"bindUser":5,"enterMployeenum":5,"regcapitalunit":5,"abnormal":5,"yeartax":5,"regtrademark":5},null,"4158391","\u002Fprofile\u002Fupload\u002F2023\u002F12\u002F02\u002F7d10b73c22337a9ae0432cebec6fa208.gif","力成","05licheng",723745,10380,"1997年","台湾省",323,0,"1","力成科技股份有限公司",[],"创于1997年中国台湾,提供完善的半导体后段供应链建置及全方位封装测试服务,涵盖晶圆针测\u002F封装\u002F测试\u002F预烧至成品的全球出货。","力成简介-力成芯片封装-中国品牌之家","力成品牌介绍,力成科技股份有限公司,力成联系电话,力成芯片封装,力成","力成品牌简介，中国品牌之家为你介绍力成科技股份有限公司旗下力成品牌信息，包括品牌介绍、联系方式、主营产品、最新评论、点赞数量等，告诉你力成芯片封装怎么样，致力于帮助你了解力成真实有效的品牌相关信息。","力成科技成立于1997年，在全球集成电路的封装测试服务厂商中居于领导地位。力成科技的服务范围涵盖晶圆凸块、针测、IC封装、测试、预烧至成品以及固态硬盘封装的全球出货。2017年为日本车用电子及物联网业布局，将生产基地扩展至日本；2018年为先进面板级扇出型封装布局，于新竹科学园区投入高阶封装新厂建设计划。\n\n善用策略性结盟模式及永不止于现状的改善态度，让力成科技凭借先进技术、世界厂房以及满足客户经济且效能高的需求条件下，提供良好的质量与服务。力成科技是全球前列的外包封测厂商，同时传承在内存领域领先的根基，持续往更先进的技术努力并提供完善的服务，期望成为世界封测大厂。\n\n2014年12月，力成科技总部决定与世界500强企业美光科技强强联手，正式签约，共同投资2.5亿美元在西安市高新区设立芯片封装厂。公司命名为力成半导体（西安）有限公司。2016年3月25日力成半导体（西安）正式开幕，2016年4月份开始量产。","1999-12-31","-","www.ptixa.com\u002F","csr@pti.com.tw",{"enterId":29,"enterName":17,"province":5,"city":5,"area":5,"detailaddress":13,"unifiedscc":5,"enterType":5,"enterLegalperson":5,"enterStablishdate":24,"regauthority":5,"licenseValidity":25,"approvaldate":24,"regcapital":5,"incapital":5,"businessscope":5,"ownBrand":5,"enterTelphone":5,"enterWebsite":26,"business":5,"performance":5,"socialSecurity":5,"registrationNumber":5,"enterQq":5,"enterMail":27,"bindUser":5,"enterMployeenum":5,"regcapitalunit":5,"abnormal":5,"yeartax":5,"status":15,"regtrademark":5,"remark":5},"723745",{"createTime":5,"updateTime":5,"createBy":5,"updateBy":5,"id":5,"brandId":5,"brandName":5,"busmodel":5,"franchiseFund":5,"totalStores":5,"devmodel":5,"franchiseIndustry":5,"investmenttel":5,"suitablePeople":5,"state":5},[],[],[34],{"createTime":35,"updateTime":36,"createBy":5,"updateBy":5,"industryId":37,"webId":5,"industryName":38,"industryAlias":5,"industryIcon":5,"industryTrans":39,"pageTitle":40,"pageDesc":41,"pageKeywords":42,"mainTitle":43,"pageSubtitle":44,"indSummary":45,"industryLevel":46,"parentId":47,"parentName":5,"sortOrder":48,"status":15,"classifyVisit":5,"totalVisits":49,"searchName":5,"starLevel":5,"limit":5},"2000-01-01 00:00:00","2026-06-16 16:50:00","10380","芯片封装","\u002Fprofile\u002Fupload\u002F2023\u002F11\u002F08\u002F371fb87c4eb9609ca41c22b5fa486c2f.jpeg","十大芯片封装企业-芯片封装公司有哪些-芯片封装厂商有哪些-ZGALL品牌榜","2026年芯片封装行业十大品牌权威发布！芯片封装排行榜前十名品牌有日月光、安靠、长电、通富微电、华天、力成、京元电子、WLCSP、日月新、UTAC。芯片封装10大品牌排行榜由品牌研究部门收集整理大数据分析、研究得出，帮助你了解芯片封装哪个牌子好。","芯片封装公司排名,业界主流的芯片封装厂,十大芯片封装公司排名,十大芯片封装品牌,中国十大芯片封装公司","芯片封装品牌排行榜","2026芯片封装企业排行榜，半导体封测-封测代工厂，集成电路封装测试企业有哪些","芯片封装哪个好？品牌TOP榜权威发布2026年芯片封装名录；居前十的有：日月光、AMKOR安靠、长电科技JCET、通富微电、华天科技HUATIAN、力成Powertech Technology、京元电子KYEC、WLCSP、日月新ATX、UTAC等，【行业品牌名录】基于大数据与人工智能技术，整合300+国际权威榜单及企业申报数据，通过算法分析市场占有率、创新力等12项指标，并解析超百万条舆情信息，采用加权模型（算法60%+专家30%+用户10%）生成动态排名。数据月度更新，申报需通过ISO认证审核，排名不分先后，仅供参考。",3,4965,99,717]